高频混压板可以是FR4和高频板材的混合，或者不同DK的高频板材的混合，这种电路板具有耐高温性能和优异耐辐射性，这种结构的高频电路板能够满足局部高频信号传输的要求，领智电路是一家专业提供TU933 PCB打样，TU933 PCB加工，TU933 PCB批量制作等一站式印刷电路板的生产厂家。ThunderClad 3 is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability.ThunderClad 3 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.
1. Applications
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Radio frequency
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Backplane, High performance computing
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Line cards, Storage
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Servers, Telecom, Base station
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Office Routers
2. Performance and Processing Advantages
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Excellent electrical and thermal properties
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Dielectric constant is 3.4 @ 10Gz
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Dissipation factor is 0.0025 @ 10Ghz
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Stable and flat Dk/Df performance over frequency and temperature variance.
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Compatible with modified FR-4 processes
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Excellent moisture resistance and Lead Free reflow process compatible
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Improved z-axis thermal expansion
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Superior dimensional stability, thickness uniformity and flatness
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Anti-CAF capability
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Excellent through-hole and soldering reliability
3. Industry Approvals
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IPC-4101E Specification Number : /102
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IPC-4101E/102 Validation Services QPL Certified
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UL File Number: E189572
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ANSI Grade: No-ANSI
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Flammability Rating: 94V-0
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Maximum Operating Temperature: 140°C
4. Standard Availability
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Thickness: 0.002”[0.05mm] to 0.062”[1. 58mm], available in sheet or panel form
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Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
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Prepregs: Available in roll or panel form
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Glass Styles: 1035, 1078, 2113, 2116 and other prepreg grades are available upon request.
