高频混压板可以是FR4和高频板材的混合，或者不同DK的高频板材的混合，这种电路板具有耐高温性能和优异耐辐射性，这种结构的高频电路板能够满足局部高频信号传输的要求，领智电路是一家专业提供TU883 PCB打样，TU883 PCB加工，TU883 PCB批量制作等一站式印刷电路板的生产厂家。ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
1. Applications
-
Radio frequency
-
Backplane, High performance computing
-
Line cards, Storage
-
Servers, Telecom, Base station, Office Routers
2. Performance and Processing Advantages
-
Excellent electrical properties
-
Dielectric constant less than 4.0
-
Dissipation factor less than 0.005
-
Stable and flat Dk/Df performance over frequency and temperature
-
Compatible with modified FR-4 processes
-
Excellent moisture resistance and Lead Free reflow process compatible
-
Improved z-axis thermal expansion
-
Anti-CAF capability
-
Excellent through-hole and soldering reliability
-
Halogen Free
3. Industry Approvals
-
IPC-4101 Type Designation: /134
-
IPC-4101/134 Validation Services QPL Certified
-
UL File Number : E189572
-
ANSI Grade : No-ANSI
-
Flammability Rating: 94V-0
-
Maximum Operating Temperature: 160°C
4. Standard Availability
-
Thickness: 0.002”[0.05mm] to 0.062”[1. 58mm], available in sheet or panel form
-
Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
-
Prepregs: Available in roll or panel form
-
Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request
